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YE-3234

Product Introduction

Using imported natural quartz sand and electric melting process, we provide high-purity, low bubble rate, and low OH content quartz materials for semiconductors

Application area

Quartz components that can be used in high and low temperature areas of semiconductor processes, such as quartz flanges, quartz rings, quartz boats, etc

Product advantages

OH≤30ppm, Has extremely high thermal stability. High purity and low bubble rate, avoiding particle generation during plasma etching, high-temperature oxidation and other processes, improving semiconductor process yield.

Specification parameters

Typical trace impurity content(ppm)

Impurity contentAIBLikeCoCrWithFeKLiMgMnNaNiTiOH
YE-3234≤13≤0.1≤1.0≤0.006≤0.03≤0.5≤1.0≤0.9≤0.5≤0.62≤0.06≤1.0≤0.27≤2.2≤20


Product Features


productmodelTypical dimensions (mm)application areaProduct Features
Fused quartz ingotYE-3234φ1900×H500Semiconductors, photovoltaics

Industry, etc

High purity, OH content and gas

Low foaming rate and good high temperature resistance


Optical Transmittance Performance


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Mechanical/Thermal Properties


parameterCompanyElectric fused quartzparameterCompanyElectric fused quartz YE series

density

g/cmthree

two point two





Mohs hardness-6~7Strain point (η=1014.5dPa · s)

°C

one thousand and one hundred

Young's modulusGPa

seventy

Annealing point (η=1013dPa · s)°Cone thousand two hundred and ten
shear modulus GPathirty

Softening point (η=107.6kPa · s)

°Cone thousand seven hundred and twenty
Poisson's ratio-zero point one seven

Coefficient of thermal expansion



compressive strengthGPa1.1320~100°C×10-6/°C

zero point four nine

tensile strengthMPaforty-nine20~thirty0°C×10-6/°Czero point five five
bending strength MPaninety-four20~600°C×10-6/°Czero point five four